Tape for Dicing
Product Detail
- Strong Adhesion before UV Irradiation
Easy Peel-off after UV Irradiation
Various Line-up for Special Application such as Glass, Wafer with Metal etc…
This tape is used to hold semiconductor wafer during dicing/singulation process.
Feature
Tape for Dicing
| Tape | Wafer Dicing UC Series | Package Dicing FC Series |
|---|---|---|
| Features | UV Type | UV Type |
| Release Film | PET | PET |
| Adhesive | Acrylic | Acrylic |
| Backing Film | Polyolefin | Polyolefin |
Characteristics (Main Products)
UC Series for Compound wafer
| Tape | UC3044M-110E | UC3044M-110B | UC3139M-85 | UC-334EP-85 | ||
|---|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 100 | 100 | 80 | 80 | ||
| Adhesive Thickness (µm) | 10 | 10 | 5 | 5 | ||
| Adhesive Strength (N/25mm) | ♯280-SUS | Before UV | 5.1 | 2.5 | 4.9 | 1.5 |
| After UV | 0.3 | 0.2 | 0.5 | 0.3 | ||
| Si-Wafer | Before UV | 1.8 | 1.1 | 2.2 | 1.1 | |
| After UV | 0.1 | 0.1 | 0.1 | 0.2 | ||
| Features | Less chipping | Less chipping | Suitable for thin wafers | Suitable for back side metal | ||
(note)Data shown above are typical values and not guaranteed values.
FC Series for Package Dicing
| Tape | FC2127M-165 | FC-224M-170 | FS-8304-170 | ||
|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 150 | 150 | 150 | ||
| Adhesive Thickness (µm) | 15 | 20 | 20 | ||
| Adhesive Strength (N/25mm) | ♯280-SUS | Before UV | 8.3 | 6.1 | 4.9 |
| After UV | 0.7 | 0.4 | 0.5 | ||
| Si-Wafer | Before UV | 8.9 | 5.2 | 5.5 | |
| After UV | 0.5 | 0.3 | 0.3 | ||
| Features | Suitable for small-sized package | Less/no whisker | Antistatic | ||
(note)Data shown above are typical values and not guaranteed values.