Low-pressure Oxidation & Annealing Equipment

Product Detail

Low-pressure oxidation/annealing furnaces are mainly used for oxidation and annealing processes of crystalline silicon in the solar industry, as well as oxidation, annealing, alloying and sintering processes for large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices, optical fibers and other industries.




Equipment Features：

- Compatible with wafer sizes up to 230 mm

- Adopts flexible furnace door support mechanism and rotatable furnace door design. Replacement of furnace mouth sealing rings and furnace door maintenance can be performed without cooling down the equipment, facilitating easier maintenance and effectively extending the service life of quartz tubes and furnace body

- Features proprietary patented rapid cooling technology, cutting process time by more than 10 minutes after high-temperature oxidation

- Mature wet oxidation process improves high-temperature oxidation rate, lowers oxidation temperature and extends the service life of quartz components