Low-pressure Boron Diffusion Equipment

Product Detail

Low-pressure boron diffusion equipment is used for PN junction fabrication in N-type crystalline silicon processes such as TOPCon and TBC.




Equipment Features：

- Process Compatibility: Compatible with wafer sizes up to 230 mm, supporting multiple processes including boron diffusion, oxidation, annealing and phosphorus diffusion

- Innovative Furnace Door Mechanism: Adopts flexible furnace door support mechanism and rotatable furnace door design. Replacement of furnace mouth sealing rings and furnace door maintenance can be performed without equipment cooling, enabling easier maintenance and effectively extending the service life of quartz tubes and furnace body

- Excellent Anti-Corrosion Design: Anti-corrosion treatment applied on the furnace mouth surface; no exposed metal inside the entire reaction chamber to guarantee process cleanliness and passivation performance

- Rapid Cooling: Features proprietary patented rapid cooling technology, cutting process time by more than 10 minutes after high-temperature oxidation

- Wet Oxidation Process: Mature wet oxidation process to increase high-temperature oxidation rate, reduce oxidation temperature and extend the service life of quartz components